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550PF-300 550PF-300

Home / Products / PEEK / ZYPEEK Polymers / 550PF-300

550PF-300

Unfilled Fine Power

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Grain diameter(D50) 3D printing Compression Molding

Ground from coarse powder, 300 mesh, particle size 50μm. For compound modification, compression molding and 3D printing. Used in mechanical, automotive, food processing and electronic parts.

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Heat-resistant

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Corrosion Resistance

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Flame Retardance

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Low smoke emission

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Wear resistance

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Wave-Transparence

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Toughness

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Properties Table Application Areas Certification Related Resources

Properties Table

TEST
TEST STDConditions/MethodUnitResults
Mechanical Property



Tensile StrengthIS0 527Break, 23°CMPa


Yield, 23°CMPa
Tensile ElongationIS0 527Break, 23°C%
Flexural StrengthIS0 178Break, 23°CMPa


Yield, 23°CMPa




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Industry Applications

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Automotive & Transportation

High-Performance Polymers
for Next-Generation Transportation

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Aerospace

Lighten the Mass, Strengthen the Mission, Expand the boundaries

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Electronics &semiconductor

Enabling the precision of digital future with innovative materials

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Industrial

Engineered to Outlast the Machine and remold the efficiency

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