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中研股份

中研股份

中研股份

中研股份

中研股份

中研股份

PEEK ZYPEEK Polymers ZYPEEK Forms ZYPEEK Parts

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CN EN

550PF-300

Unfilled Fine Power

Add Comparison 中研股份

Grain diameter(D50) 3D printing Compression Molding

Ground from coarse powder, 300 mesh, particle size 50μm. For compound modification, compression molding and 3D printing. Used in mechanical, automotive, food processing and electronic parts.

Heat-resistant

Corrosion Resistance

Flame Retardance

Low smoke emission

Wear resistance

Wave-Transparence

Toughness

Sample Request

Properties Table Application Areas Certification Related Resources

Properties Table

TEST	TEST STD	Conditions/Method	Unit	Results
Mechanical Property
Tensile Strength	IS0 527	Break, 23°C	MPa
		Yield, 23°C	MPa
Tensile Elongation	IS0 527	Break, 23°C	%
Flexural Strength	IS0 178	Break, 23°C	MPa
		Yield, 23°C	MPa

Download Performance Specifications

Industry Applications

Automotive & Transportation

High-Performance Polymers
for Next-Generation Transportation

Aerospace

Lighten the Mass, Strengthen the Mission, Expand the boundaries

Electronics &semiconductor

Enabling the precision of digital future with innovative materials

Industrial

Engineered to Outlast the Machine and remold the efficiency

Related Products

Related Materials

ZYPEEK Product Manual

ZYPEEK Product Manual

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ZYPEEK Processing Guide

ZYPEEK Processing Guide

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PEEK Unfilled Resin

G series-550PF-300 Unfilled Fine Powder

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