770PF-300
Unfilled Fine Power
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Grain diameter(D50)
3D printing
Compression Molding
770PF-300 is ground from coarse powder, 300 mesh, particle size 50μm. It is commonly used as raw material for PEEK compression molding with standard flowability. 770PF can also be filled with other inorganic fillers.
Heat-resistant
Corrosion Resistance
Flame Retardance
Low smoke emission
Wear resistance
Wave-Transparence
Toughness
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